Metal oxide semiconductor (mos) controlled devices and methods of making the same

ABSTRACT

Metal-Oxide-Semiconductor (MOS) controlled semiconductor devices and methods of making the devices are provided. The devices include a gate which controls current flow through channel regions positioned between source/emitter and drain regions of the device. 
     The devices include a gate oxide layer having a variable thickness. The thickness of the gate oxide layer under the edge of the gate and over the source/emitter regions is different than the thickness over the channel regions of the device. The oxide layer thickness near the edge of the gate can be greater than the oxide layer thickness over the channel regions. The source/emitter regions can be implanted to provide enhanced oxide growth during gate oxide formation. The source/emitter region can include regions that are implanted to provide enhanced oxide growth during gate oxide formation and regions which do not provide enhanced oxide growth during gate oxide formation. The devices can be SiC devices such as SiC MOSFETs and SiC IGBTs.

CROSS REFERENCE TO RELATED APPLICATION

This is divisional of, and claims priority to, pending U.S.non-provisional patent application Ser. No. 15/636,712, filed Jun. 29,2017, the entirety of which applications are incorporated by referenceherein.

STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH

This invention was made with government support under Grant No.DE-AR0000442 awarded by the Department of Energy. The government hascertain rights in the invention.

BACKGROUND Technical Field

This application relates generally to metal oxide semiconductor (MOS)controlled semiconductor devices and, in particular, to SiCMOS-controlled semiconductor devices.

Background of the Technology

MOS controlled semiconductor devices are based on the insulatingproperties of the oxide (i.e., SiO₂) layer. As with any other dielectricmaterial, there is a maximum field that makes the oxide lose itsinsulating properties (i.e., breakdown electric field) as it is applied.While MOS devices typically operate at a lower field, if that lowerelectric field is applied for a long enough time the oxide will slowlydegrade (i.e., wear out) and eventually break down. This time dependentdielectric breakdown is an important parameter for MOS controlled devicereliability. The problem of time dependent dielectric breakdown has beenexacerbated by the drive in the semiconductor industry for ever smallerdevice geometries.

Accordingly, there still exists a need for MOS controlled semiconductordevices such as SiC devices having improved oxide wear-out lifetimecharacteristics.

SUMMARY

According to a first embodiment, a semiconductor device is providedwhich comprises:

a drift layer of semiconductor material of a first conductivity typecomprising an upper surface and a lower surface;

a semiconductor substrate in direct or indirect contact with the lowersurface of the drift layer;

an oxide layer on and in direct contact with the upper surface of thedrift layer; a gate electrode layer on the oxide layer opposite thedrift layer;

wherein the upper surface of the drift layer comprises: one or more JFETregions of a semiconductor material of the first conductivity type;first and second channel regions of a semiconductor material of a secondconductivity type different than the first conductivity type oppositeand adjacent each of the one or more JFET regions; and first and secondsource/emitter regions of a semiconductor material of the firstconductivity type adjacent the first and second channel regions,respectively, opposite the JFET region;

wherein the oxide layer comprises a central region over the JFET region,first and second inner peripheral regions adjacent the central regionand over the first and second channel regions and first and second outerperipheral regions adjacent the first and second inner peripheralregions and opposite the central region;

wherein the gate electrode layer extends over the JFET region and theadjacent channel regions and wherein the gate electrode layer has afirst edge on the first outer peripheral region of the oxide layer and asecond edge on the second outer peripheral region of the oxide layer;

wherein the oxide layer has a first average thickness in the centralregion and a second average thickness in the first and second innerperipheral regions, wherein the first average thickness is differentthan the second average thickness by at least 25%.

According to a second embodiment, a method of making a semiconductordevice having an oxide layer of varying thickness is provided whichcomprises:

implanting a first implant species into a surface of a layer of SiCsemiconductor material to form a first region of a first conductivitytype;

implanting a second implant species into the surface of the layer of SiCsemiconductor material to form a second region of the first conductivitytype, wherein the first and second regions have different implantspecies, different implant levels and/or different levels ofimplantation induced damage;

forming an SiO₂ layer on the first and second regions by exposing thesurface of the SiC semiconductor material to an oxidant at an elevatedtemperature such that SiO₂ forms on the first and second regions,wherein the SiO2 forms at a different rate on the first and secondregions;

wherein the SiO₂ layer is formed on the first and second regions untilthe difference between a first average thickness in the first region anda second average thickness in the second region is at least 25%.

BRIEF DESCRIPTION OF THE DRAWINGS

The drawings described below are for illustration purposes only. Thedrawings are not intended to limit the scope of the present teachings inany way.

FIG. 1 is a schematic cross sectional view of a MOSFET device having avariable gate oxide thickness according to some embodiments wherein thedevice has a thicker oxide layer in the gate corner region than in theplanar region over the channel.

FIG. 2 is a schematic cross sectional view of a MOSFET device having avariable gate oxide thickness according to some embodiments wherein thedevice has a thicker oxide layer in the gate corner region than in theplanar region over the channel and wherein the device has two differentsource implant regions.

FIG. 3A is a schematic cross sectional view of a MOSFET device having avariable gate oxide thickness according to some embodiments wherein thedevice has a thicker oxide layer in the planar region over the channelthan in the gate corner region.

FIG. 3B is a schematic cross sectional view of a MOSFET device having avariable gate oxide thickness according to some embodiments wherein thedevice has a thicker oxide layer in the gate corner region and in theplanar region over the channel and wherein the oxide layer is thinnerover the P-well region which forms the channel of the device.

FIGS. 4A-4M are schematics illustrating a method which can be used tomake a MOS-controlled device having a variable gate oxide thickness.

FIGS. 5A-5G are schematics illustrating a method of making aMOS-controlled device having a variable gate oxide thickness wherein thedevice comprises two different source implant regions.

DETAILED DESCRIPTION

As used herein, a layer, region or other feature of a semiconductordevice which is “on” another layer, region or other feature of thedevice may be in either in direct contact with the other layer orindirect contact with the other layer, region or feature. When a firstlayer, region or other feature of a semiconductor device is in indirectcontact with another layer, region or other feature, there may be one ormore additional layers between the two layers, regions or other featuresof the device.

As used herein, an average thickness of a layer or region is determinedby measuring the thickness at a plurality of locations in the layer orregion and dividing by the number of measurements taken.

As used herein, layers, regions or other features of a semiconductordevice which are “adjacent” one another are in close proximity. Adjacentlayers, regions or other features may be in direct contact (i.e.,contiguous) with one another but may also be separated from one another.

As used herein, an “elevated temperature” is a temperature above roomtemperature.

As used herein, a dimension which is “about” a recited amount means thatthe dimension has a value that is within +/−10% of the recited amount.For example, a feature which has a length of about 10 μm is from 9-11 μmlong.

As used herein, first and second layers, regions or other features of asemiconductor device described as being “opposite and adjacent” anotherlayer, region or feature are on opposite sides of the other layer,region or feature of the device.

MOS-controlled devices with improved gate oxide reliability aredescribed. The devices may be SiC-based devices. ExemplaryMOS-controlled devices include but are not limited to a SiC MOSFET and aSiC IGBT. These devices can be vertical or lateral MOS-controlleddevices. Methods of making the devices are also provided.

Long term gate oxide reliability is required in MOS controlledsemiconductor devices to ensure that the gate oxide does not degrade ordestructively fail during the operating conditions, including at highelectric field and high temperatures. Several of the main factors thatcontrol the oxide reliability wear-out are the concentration of oxide“extrinsic” defects, the oxide electric field and the temperature.First, clean and low-defect processes and tools are required toeliminate or minimize the oxide “extrinsic” defects which contribute toearly failure of the gate oxide under the operating conditions. Second,since the oxide wear-out lifetime decreases with increasing gate oxideelectric field, to maximize the “intrinsic” oxide lifetime it ispreferable to minimize the gate oxide electric field. Due to therelatively poor inversion-layer mobility in SiC MOS-controlled devices,it is often preferable to operate at high gate oxide electric fields inthe range of 3-4 MV/cm to minimize the channel resistance. This electricfield is estimated by the nominal applied voltage (typically 20 V)divided by the nominal oxide thickness (typically 50 nm). By operatingat high electric fields this can reduce the long-term wear-out lifetimeof the gate oxide. Additionally, any localized high electric fields inthe gate oxide can further reduce the gate oxide wear-out lifetime.Thus, it is important to ensure that the gate oxide electric field isminimized.

The gate oxide thickness of a conventional SiC MOS-controlled devices ismostly uniform. For example, the variation of gate oxide thickness for aconventional SiC MOS-controlled devices is typically less than 25%across the main channel region of the device to the end of the gateelectrode. The gate oxide can be considered to consist of two generalregions: a “planar” or central region over the channel and JFET regionsof the device, and a peripheral region under the corner or edge of thegate electrode adjacent the source/emitter contact. In the planarregion, the gate oxide electric field is nominally defined by the gatevoltage divided the gate oxide thickness. Typical SiC MOS-controlleddevices operate at 3 to 4 MV/cm. The gate electrode corner can induce ahigh electric field in the gate oxide at the end of the gate electrode.The electric field in gate electrode corner region can be significantlyhigher than the electric field in the planar region. While not wishingto be bound by any theory, the high electric field at the gate electrodecorner can limit the wear-out lifetime of the MOS-controlled device.

According to some embodiments, a SiC MOS-controlled device having a gateoxide layer with a variable thickness is provided. According to someembodiments, the device has a thicker gate oxide under the gateelectrode corner adjacent the ohmic contact for the source region.According to some embodiments, the gate oxide thickness in the planarregion under the gate electrode has a thickness greater than thethickness of the gate oxide layer in the gate electrode corner region.

By providing a gate oxide thickness in the gate electrode corner regionhaving a thickness greater than the gate oxide thickness in the planarregion, the maximum gate oxide electric field at the gate corner can bereduced thereby providing devices with improved gate oxide reliabilityand a longer gate oxide mean time to failure.

FIG. 1 is a schematic cross sectional view of a MOSFET device 100 havinga variable gate oxide thickness according to some embodiments whereinthe device has a thicker oxide layer in the gate corner region than inthe planar region over the JFET and channel regions. As shown in FIG. 1,drift layer 102 is formed on substrate 122. P-well region 104 is formedin drift layer by ion implantation. Source-emitter region 106 is formedin p-well region 104 spaced from the edges of the p-well region to formp-type channels. JFET regions are on the left and right side of thedrawing adjacent the p-channel regions opposite the source/emitterregion 106. Gate oxide layer 110 is formed on exposed surfaces of thesource/emitter region 106, channel and JFET regions. As shown in FIG. 1,gate oxide layer 110 is thicker over source/emitter region 106. P+region112 is formed in center of source/emitter region 106 and p-well region104. Ohmic contact 114 is shown in source/emitter region 106 andp+region 112. Gate electrode 116, interlayer dielectric 118 and sourcemetal 120 are also shown. The corner 124 of the gate electrode is alsoshown in FIG. 1. As can be seen in FIG. 1, the gate oxide layer 110 isthicker under gate electrode corner 124 than over the channel and JFETregions of the device.

A method of making a SiC MOS-controlled device having a gate oxide layerwith a varying thickness as described above is also provided. Accordingto some embodiments, the device is a vertical MOSFET device and thestarting material can be an n+SiC substrate with an n-type SiC epilayerformed on then +SiC substrate. According to some embodiments, a p-wellregion is patterned and implanted in an n-type drift layer on asemiconductor substrate. The p-well may be patterned using an oxidemask. Then, the source region can be patterned and implanted in thep-well region using an oxide and/or photoresist mask. According to someembodiments, the source region implant species may comprise Nitrogen andPhosphorus with a dose greater than 4×10¹⁴ cm·². According to someembodiments, the source region implant may include other species such asSi or C or other inert species such as Ar. The source implantation caninclude a combination of implant species with different implant dosesand implant energies. The combination of implant species, implant energyand implant dose can be selected to enhance the oxidation rate in thesource implant region. While not wishing to be bound by any theory, theincrease in implantation-induced damage and/or the high n-type dopingconcentration may accelerate the oxidation rate in the n-plus implantedregion. Then, p-plus regions are patterned and implanted. Other regionsof the device (not shown in FIG. 1) may be implanted with n-type andp-type regions to form the MOS-controlled device structure, includingtermination and field stop regions or other regions. Then, the sample isannealed at temperatures >1600° C. to activate the implanted regions.Next, the field oxide is deposited, patterned and etched. Next, the gateoxide is grown by thermal oxidation of the SiC surface. The gate oxidethickness varies across the sample, based upon the presence of theimplant-damaged region and the presence of a high concentration n-plusdopant species. In one embodiment, the gate oxide thickness is nominally50 nm in the planar gate oxide region and the gate oxide thickness is150 nm in the region toward the edge of the gate electrode. The shape ofthe gate oxide transition between the planar region and the n-plusregion is a smooth transition, and the gate oxide in the n-plus regionsis “recessed”, that is, it extends below the surface of the SiC in theplanar region. This recessed gate oxide structure with an increasedthickness on one side is sometimes referred to as a “birds-beak”.

According to some embodiments, the device is a vertical IGBT and thestarting material can be an n+SiC substrate with a p-type SiC layerformed on the substrate and an n-type SiC layer formed on the p-type SiClayer. Then-type and p-type layers can be formed by epitaxial growth.

FIG. 2 is a schematic cross sectional view of a MOSFET device 200 havinga variable gate oxide thickness according to some embodiments whereinthe device has a thicker oxide layer in the gate corner region than inthe planar region over the JFET and channel regions and wherein thedevice has two different source implant regions. As shown in FIG. 2, thedevice has first 202 and second 204 source/emitter implant regions. Ascan be seen in FIG. 2, the gate oxide layer 110 is thicker under gateelectrode corner 124 over second source/emitter region 204 than over thechannel and JFET regions of the device.

FIG. 3A is a schematic cross sectional view of a MOSFET device 300having a variable gate oxide thickness according to some embodimentswherein the device has a thicker gate oxide layer 110 in the planarregion over the JFET and channel regions than in the gate corner regionunder gate corner 124. As can be seen in FIG. 3, the gate oxide layer110 is thicker over the JFET region of the device than it is under gateelectrode corner 124.

FIG. 3B is a schematic cross sectional view of a MOSFET device 350having a variable gate oxide thickness according to some embodimentswherein the device has a thicker oxide layer 110 in the gate cornerregion 124 and over the JFET region and wherein the oxide layer isthinner over the P-well region 104 which forms the channel of thedevice.

A method of making a SiC MOSFET device having a variable gate oxidethickness according to some embodiments is depicted in FIGS. 4A-4M. Thecross section is shown in the active area of the device. The methoddepicted in FIGS. 4A-4M can be used to make a device as depicted in anyof FIGS. 1-3 above.

As shown in FIG. 4A, a drift layer 404 is formed on a semiconductorsubstrate 402. The drift layer may be formed via epitaxial growth ofsemiconductor material on semiconductor substrate 402. The exposedsurface of the drift layer corresponds to the front side of the devicewhereas the exposed surface of the substrate corresponds to the backside of the device.

As shown in FIG. 4B, a layer of SiO₂ 410 can then be deposited andpatterned and etched on the front side of the device to form openingsfor implantation of the p-well regions. As shown in FIG. 4C, a screeningoxide layer 414 can then be deposited on the front side of the deviceand the p-well regions 412 implanted through the openings in the layerof SiO₂ 410. The distance between the edges of the p-well regions 416 isalso shown in FIG. 4C. According to some embodiments, this distance 416can be 1 to 5 μm. According to some embodiments, this distance 416 canbe 1.5 to 4 μm. According to some embodiments, this distance 416 can beabout 2.4 μm.

As shown in FIG. 4D, a sidewall layer 418 can then be formed on thesidewalls of the openings in the layer of SiO₂ 410. Sidewall layer 418can be formed by depositing a layer of SiO₂ on the front side of thedevice and anisotropically etching to selectively remove the depositedlayer from the upper surface of layer of SiO₂ 410. The width 420 ofspacer 418 is also shown in FIG. 4D. According to some embodiments,width 420 can be 0.7 μm to 0.8 μm.

As shown in FIG. 4E, a photoresist or other n-type blocking material 422can then be patterned on the front side of the device to blockimplantation of portions of the P-type well regions with n-type dopants.Then-type blocking material 422 is not required and the p-type regions432 can be implanted over then-type regions.

As shown in FIG. 4F, n-type dopants are then implanted in the exposedp-well regions 412 to form n-type regions 428. Then-type regions 428 canbe formed as described above using a combination of implant species,dosage and energy to enhance SiC oxidation in then-type regions duringgate oxide formation to provide a device as depicted in FIG. 1. Dualn-type regions can also be formed to provide a device as depicted inFIG. 2. A method for forming dual implanted regions is described belowand depicted in FIGS. 5A-5G. The width 424 of then-type blockingmaterial and the distance between

the edge of the n-type blocking material and the edge of the p-wellregion 426 are shown in FIG. 4F.

As shown in FIG. 4G, the photoresist and oxide layers are removed fromthe front side of the device and an SiO₂ layer 430 is deposited,patterned and etched to form openings for the implantation of p+regions432.

As shown in FIG. 4H, gate oxide layer 447 can then be formed. As setforth above, n-type regions 428 can be formed using a combination ofimplant species, dosage and energy to enhance SiC oxidation in then-typeregions 428 during gate oxide formation.

As a result, a thicker gate oxide layer is formed over n-type regions428 than over the JFET and channel regions of the device as shown in thedevice depicted in FIG. 1.

As also shown in FIG. 4H, after formation of the gate oxide layer, thegate electrode is formed. The gate electrode layers can include apolysilicon layer 448 and a silicide layer 450. The silicide layer 450can be a WSi₂ layer formed by, for example, sputtering. WSi₂ is merelyan exemplary silicide material and other materials can be used.

As shown in FIG. 41, the silicide 450 and polysilicon 448 layers areselectively etched to form the gate electrode. As shown in FIG. 41, thegate electrode has a width dimension 452. According to some embodiments,the width dimension 451 of the gate electrode can be about 4.5 μm.

As shown in FIG. 4J, sidewall spacers 452 can then be formed on thesidewalls of the gate electrode followed by deposition of the interlayerdielectric (ILD) material 454. Although sidewall spacers 452 are shownin FIG. 4J, the sidewall spacers 452 are not required.

As shown in FIG. 4K, the ILD material 454 can be selectively removed toform openings 456 over the p-type region 432 and over adjacent sourceregions 428. As shown in FIG. 4L, source ohmic contacts 458 can then beformed in openings 456. Source ohmic contacts 458 can be formed bydepositing Ni and annealing to form a silicide contact.

As shown in FIG. 4M, source metal 460 can then be deposited. A drainohmic contact can also be formed on the back side of the substrate 402(not shown). The drain ohmic contact can be formed by depositing a Nilayer and annealing. Gate contacts can also be formed (not shown). Abackside metal can then be deposited.

The device can include a central active region, a termination regionsurrounding the active region and a die seal region surrounding thetermination region. The central active region of the device can includea plurality of source regions and gate electrode regions. The sourceregions and gate electrode regions can be elongated regions (i.e.,fingers) extending in an x-direction and spaced apart in a y-directionperpendicular to the x-direction. For example, the cross-section shownin FIGS. 4A-4M can be a cross-section taken through the device in aplane formed by they and z axes of an x-y-z coordinate axis systemwherein the z axis extends in the thickness direction (i.e., through thedevice thickness from the front side to the back side), the y axisextends laterally across the device from the active region to the dieseal region and the x axis extends into the page. The source metal 460can contact each of the plurality of source regions 428 via ohmiccontacts 458 formed on each of the source regions. The device caninclude a gate runner (not shown) extending in they-direction andconnecting the plurality of gate regions together.

When utilizing a high-dose ion implant for the source/emitter regions ofthe device, the increased oxide thickness may cause a detrimental effectby providing a thicker gate oxide in the channel region near the source.According to some embodiments, two different source implant regions areprovided wherein the two regions are spaced apart from one another.

In this embodiment, the p-well is first patterned and formed by ionimplantation. The p-well implantation may be performed at roomtemperature or a temperature up to 650° C. The p-well mask could beformed by a dielectric mask, comprising silicon nitride or silicondioxide, or could be formed by a polysilicon layer or a photoresist.Then the first source implant is patterned and implanted a distance awayfrom the edge of the p-well region to form the channel region. Thisfirst source implant pattern may be self-aligned. The self-alignmentmethod for the first source implant can be performed by depositing alayer on top of the p-well mask and anisotropically etching down to thesurface to leave a spacer. Alternately, this self-aligned spacer for thefirst source implant could be formed by oxidation of a polysilicon layerused to mask the p-well implant. Other self-aligned techniques can alsobe used. The first source implant can be performed with an implantschedule of energy and dose such that the oxidation rate is notincreased in this region. In one embodiment, this dose is less than3×10¹⁴ cm⁻². This first source implant species can be Nitrogen orPhosphorus. This first source implant may be performed at roomtemperature or at temperatures up to 650° C. Next a second sourceimplant is patterned a distance away from the first source region andimplanted with a higher dose that will cause an increase in theoxidation rate over the second source region. This second source implantpattern may be self-aligned. The self-alignment method for the secondsource implant can be performed by depositing a layer on top of thefirst source implant mask and anisotropically etching down to thesurface to leave a spacer. Alternately, this self-aligned spacer for thesecond source implant could be formed by oxidation of a polysiliconlayer used to mask the p-well implant or the first source implant. Otherself-aligned techniques can also be used. In one embodiment the secondimplant species is Nitrogen or Phosphorus. The second source implantdose may be in a dose range of 5×10¹⁴ cm⁻² to 1×10¹⁶ cm⁻² This secondsource implant may be performed at room temperature or at temperaturesup to 650° C. Standard procedures can then be used to finish the devicestructure. Due to the increased dose in the second source implantregion, this embodiment may provide a decrease in sheet resistance andcontact resistance of the second source region. The second sourceimplant may be implanted to a depth that is shallower, the same, ordeeper than the first source implant depth.

A method of making a SiC MOSFET device having a variable gate oxidethickness and comprising two different source implant regions isdepicted in FIGS. 5A-5G. The cross section is shown in the active areaof the device. The device can include a plurality of additional p-wellregions and source/emitter regions in the active area of the device.

As shown in FIG. 5A, a drift layer 504 is formed on a semiconductorsubstrate 502. The drift layer may be formed via epitaxial growth on thesubstrate. The exposed surface of the drift layer corresponds to thefront side of the device whereas the exposed surface of the substratecorresponds to the back side of the device. As shown in FIG. 5A, a layerof SiO₂ 510 can be deposited and patterned and etched on the front sideof the device to form openings for implantation of the p-well regions512. The distance 516 between the p-well regions is shown in FIG. 5B.According to some embodiments, this distance 516 can be 1 to 5 μm.According to some embodiments, this distance 516 can be 1.5 to 4 μm.According to some embodiments, this distance 516 can be about 2.4 μm.

As shown in FIGS. 5B and 5C, spacers 519 can be formed on the sidewallsof the SiO₂ layer 510 by depositing a layer of SiO₂ 517 on the frontside of the device and anisotropically etching SiO₂ layer 517 toselectively remove SiO₂ from the upper surfaces of layer 510. Althoughnot shown, a photoresist or other n-type blocking layer can be depositedon SiO₂ layer 517 and selectively removed such that a portion ofthen-type blocking layer remains in a central portion of p-well 512 toprevent etching of the underlying SiO₂ layer 517 during anisotropicetching. In this manner, SiO₂ remains after anisotropic etching servingas an n-type implant blocking material.

As shown in FIG. 5D, first source implant regions 520 can then be formedin p-well regions 512. As can be seen in FIG. 5D, spacers provide p-typeregions between the first source regions 520 and the JFET region of thedevice. These p-type regions form the device channels. According to someembodiments, the dopant implanted to form first source/emitter regions512 comprises nitrogen.

As shown in FIG. 5E, second spacers 523 can be formed on first spacers519 and on the blocking material 521 on the p-well. Second spacers 523can be formed by depositing SiO₂ and anisotropically etching. As shownin FIG. 5F, second source regions 522 can then be formed in first sourceregions 520. According to some embodiments, the dopant implanted to formsecond source/emitter regions 522 comprises phosphorous. SiO₂ is thenremoved from the front side of the device as shown in FIG. 5G. Thedevice is then ready for further processing, including the formation ofthe gate oxide layer.

An MOS-controlled semiconductor device having a variable oxide thicknessas depicted in FIG. 1 was manufactured using the techniques describedabove. A cross-section of the device through the gate oxide layer wasused to measure the gate oxide thickness in various regions of the gateoxide layer. The measurements show that the oxide thickness increasedfrom about 0.05 μmin the planar region of the device (e.g., over theJFET and channel regions) to approximately 0.15 μm toward the edge ofthe polysilicon gate electrode (i.e., in the corner region under theedge of the gate electrode).

The measurements also showed that the oxide layer extended approximately0.075 μm (i.e., about half the thickness of the gate oxide layer in thisregion) below the surface of the SiC in the corner region.

According to some embodiments, an MOS-controlled semiconductor devicehaving a variable oxide thickness is provided wherein the gate oxide isthicker in the JFET region of the device. A device of this type is shownin FIG. 3. According to some embodiments, an increase in the gateoxidation rate can be provided through ion-implantation of implantspecies in the JFET region of the device. While not wishing to be boundby any theory, ion implantation and related implant damage may cause anincrease in the oxidation rate of the semiconductor material in the JFETregion of the device. The semiconductor material may be silicon carbide.The device may be a MOSFET device.

Either all or a portion of the JFET region may be implanted through ionimplantation to increase the oxidation rate during gate oxide formation.According to some embodiments, the implant species may be anelectrically active, an electrically inactive species or combinationsthereof. Exemplary electrically active species include but are notlimited to nitrogen, phosphorus, boron and aluminum or other elements.Electrically inactive species include but are not limited to silicon,carbon, argon or other elements that do not modify the electricalproperties of the underlying semiconductor substrate. According to someembodiments, the ion implant dose may be larger than 1×10¹⁴ cm⁻².According to some embodiments, the ion implant dose may be larger than1×10¹⁵ cm⁻². According to some embodiments, the ion implantation dose isin the range of 2×10¹⁵ cm⁻² to 8×10¹⁵ cm⁻².

Under subsequent gate oxidation processing, the region of thesemiconductor surface that underwent the ion implantation as describeabove has a faster oxidation rate than other regions of thesemiconductor surface. After gate oxidation, a thicker oxide layer ispresent in the implanted region of the semiconductor surface, comparedto the other regions. While not wishing to be bound by theory, thepresence of a thicker oxide in the central region of the gate electrodecan reduce the electric field present in the oxide in this region duringthe off-state of the device, thereby improving stability and reliabilityof the device.

Various exemplary embodiments of a metal oxide controlled semiconductordevice having a gate oxide layer with a variable thickness are describedbelow. These embodiments are exemplary only and are not intended to belimiting in any way.

According to some embodiments, a semiconductor device structure isprovided wherein a thermal oxide is formed on a SiC layer having avariable thickness. According to some embodiments, the thickness of thedielectric underneath the edge of the gate electrode (i.e., the gatecorner) is thicker than the gate oxide thickness in the channel region(i.e., the planar gate oxide region). According to some embodiments, thethickness of the dielectric in a central portion of the gate region isthicker than gate oxide thickness in the channel region.

According to some embodiments, the SiC semiconductor surface can berecessed based on the variation in oxide thickness. According to someembodiments, the oxide thickness at the gate corner region can begreater than 125% of the gate oxide thickness in the planar gate oxideregion.

According to some embodiments, the device comprises source/emitterimplanted regions. According to some embodiments, the source implantspecies is Nitrogen, Phosphorus or combinations thereof. The sourceimplant dose can be in the range of 1×10¹⁵ cm⁻² to 1×10¹⁶ cm⁻². Thesource implant can be phosphorus with an implant dose in the range of3×10¹⁵ cm⁻² to 8×10¹⁵ cm⁻².

According to some embodiments, the SiC can be implanted with anelectrically inactive species. According to some embodiments, the SiCcan be implanted with an electrically active (i.e., dopant) species.According to some embodiments, the SiC can be implanted with thefollowing species in the region under the gate: nitrogen, phosphorus,silicon, carbon, argon and combinations thereof.

According to some embodiments, the gate oxide thickness in the regiontoward the edge of the gate (i.e., the gate corner region) is more than125% of the thickness in the channel region (i.e., the planar gate oxideregion).

According to some embodiments, the device is a silicon carbideMOS-controlled device. According to some embodiments, the device is aSiC MOSFET device. According to some embodiments, the device is a SiCIGBT device.

According to some embodiments, first and second source implant regionsare formed, spaced apart from each other, and an oxide layer is grown onthe first and second source implant regions such that the gate oxidelayer forms at a greater thickness where the second source implant isperformed. The first and second source implant regions can be n-typeregions. According to some embodiments, the implant dose for the firstsource region can be in the range of between 2×10¹⁴ cm⁻² and 9×10¹⁴ cm⁻²The first source implant species can be Nitrogen, Phosphorus or acombination thereof. The implant dose for the second source region canbe in the range of 1×10¹⁵ cm⁻² to 1×10¹⁶ cm⁻² The second source implantspecies can be Nitrogen, Phosphorus or a combination thereof. The oxidethickness over the second source implant can be greater than 125% of thegate oxide thickness over the first source implant. The first sourceimplant and second source implant can be spaced apart by 0.1 μm to 0.5μm. The first source implant and second source implant can be spacedapart by 0.1 μm.

According to some embodiments, the first and second course implantregions can be n-type semiconductor regions formed in a well region of ap-type semiconductor material (i.e., p-well region). The first sourceimplant can be self-aligned to the p-well region. The second sourceimplant region can be self-aligned to the first source implant region.The second source implant can be implanted shallower than the implantdepth first source implant. The second source implant can be implantedto the same depth as the implant depth of the first source implant. Thesecond source implant can be implanted to a depth deeper than theimplant depth of the first source implant.

While the foregoing specification teaches the principles of the presentinvention, with examples provided for the purpose of illustration, itwill be appreciated by one skilled in the art from reading thisdisclosure that various changes in form and detail can be made withoutdeparting from the true scope of the invention.

What is claimed is:
 1. A method of making a semiconductor device havingan oxide layer of varying thickness, the method comprising: implanting afirst implant species into a surface of a layer of SiC semiconductormaterial to form a first region of a first conductivity type; implantinga second implant species into the surface of the layer of SiCsemiconductor material to form a second region of the first conductivitytype, wherein the first and second regions have different implantspecies, different implant levels and/or different levels ofimplantation induced damage; forming an SiO₂ layer on the first andsecond regions by exposing the surface of the SiC semiconductor materialto an oxidant at an elevated temperature such that SiO₂ forms on thefirst and second regions, wherein the SiO₂ forms at a different rate onthe first and second regions; wherein the SiO₂ layer is formed on thefirst and second regions until the difference between a first averagethickness in the first region and a second average thickness in thesecond region is at least 25%.
 2. The method of claim 1, wherein theSiO₂ layer is formed until: the first average thickness is differentthan the second average thickness by at least 50%; the first averagethickness is different than the second average thickness by at least100%; the first average thickness is different than the second averagethickness by at least 200%; or the first average thickness is differentthan the second average thickness by at least 300%.
 3. The method ofclaim 1, wherein at least a portion of the second region is formed onthe first region.
 4. The method of claim 3, wherein: the second regionis formed within the first region such that the second region is betweenfirst and second portions of the first region; wherein the SiO₂ layerhas the first average thickness over the second region and the secondaverage thickness over the first and second portions of the firstregion.
 5. The method of claim 4, the method further comprising: forminga well region of semiconductor material of a second conductivity typedifferent than the first conductivity before implanting the first andsecond implant species; wherein the first and second regions are formedin the well region such that first and second portions of the wellregion are adjacent the first and second portions of the first region,respectively.
 6. The method of claim 5, further comprising: forming agate electrode on the SiO₂ layer, wherein the gate electrode layerextends over the first portion of the well region and the first portionof the first region and has a first edge on the oxide layer over thesecond region.
 7. The method of claim 1, wherein the first implantspecies is implanted at a dose of 2×10¹⁴ cm⁻² to 9×10¹⁴ cm⁻².
 8. Themethod of claim 1, wherein the first implant species comprises Nitrogen,Phosphorus or a combination thereof.
 9. The method of claim 1, whereinthe second implant species is implanted at a dose of 1×10¹⁵ cm⁻² to1×10¹⁶ cm⁻².
 10. The method of claim 1, wherein the second implantspecies comprises Nitrogen, Phosphorus, Silicon, Carbon, Argon, Neon ora combination thereof.
 11. The method of claim 1, wherein the oxidethickness over the second region is greater than 125% of the gate oxidethickness over the first region.
 12. The method of claim 4, wherein thefirst and second portions of the first region have a width of about 0.1μm.
 13. The method of claim 4, wherein the first and second regions areelongate regions extending in an x direction in the drift layer andhaving edges in a y-direction perpendicular to the x-direction, whereinthe edges of the second region are spaced from the edges of the firstregion in they-direction by 0.1 μm to 0.5 μm.
 14. The method of claim 5,wherein: the first region is formed in the well region using aself-aligned process; and/or the second region is formed in the firstregion using a self-aligned process.
 15. The method of claim 5, wherein:the second region is implanted to a shallower implant depth than thefirst region; the second region is implanted to the same implant depthas the first region; and/or the second region is implanted to a deeperimplant depth than the first region.